Configuration for TSK
APM-90A Automatic wafer prober.
-
Condition Excellent
- Vintage 1996
- Operation Software
7.00
- Single 25 wafer
Cassette
- Nickel Chuck
- 4”, 6”, 8” wafer
size with Hot Chuck
- Hot Chuck controller
from 30 to 150 C, accuracy 0.1 C
- XY position <4u
accuracy over 2mm wafer
- Off site inking
(inker nit included)
- Pin to pad alignment
- Fail Mark inspection
- Needle alignment
- Auto needle height
setting
- Color LCD display
- Off site Marking
- Bump Height setting
- Needle inspection
- Needle cleaning
- Wafer mapping
capability
- External Printing
(Printer not included)
- GP-IB
- RS232
- TTL
- State-of-the-art
user interface, color display, joystick, touch screen
- CN1, CN2, CN3, CN6
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