UF200AL Automatic Wafer Probing System Configuration
Software Version: 02.05.03
Standard Hardware Features
- Main Control System Based on VME Bus
- Hard Disk Drive
- 3-1/2” Floppy Disk Drive
- Head Stage
- Single Cassette Loader for 25 Wafers (5” to 8” Wafers)
- Wafer Inspection Tray
- Dual Robotic Wafer Transport Arms
- Pre-alignment Stage Unit
- Capacitive Non-Contact Displacement Sensor
- Advanced Wafer Alignment Unit
- High Rigidity Z Stage
- Color LCD Control Panel with Touch Panel
- Alarm Lamp Pole
Standard Software Features
- Automatic Probe to Pad Alignment
- Automatic Needle Height Alignment
- Tester Communications Port (TTL, RS-232. GP-IB)
- Multi-Site Parallel Probing for 2 Sites
- Sample Die Probing
- Real-time Color Wafer Map
UF200AL Probing System Options
- 8” Hot Chuck; Nickel Plated; +50ᴼC to +150ᴼC
- Needle Cleaning Option – 50mm Diameter Ceramic Disk & Brush
- GP-IB Interface Option
- Group Management Option
- Alignment Pass Option
- Marker Option
- Multi-Pass Probing Option
- Bump Height Option
- Group Index Option
- Vertical Needle Option
- Soak Time Option
